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EuroPAT-MASIP: electronics packaging ecosystem
EuroPAT-MASIP increases the competitiveness and global market share of the European semiconductor industry and accelerating the manufacturing uptake of the new technologies.
€7.2 m
in funding
3
years
28
partners
9
countries
Key numbers
About the project
The main goals of the “European Packaging, Assembly and Test Pilot for Manufacturing of Advanced System-in-Package” project were to support the European packaging ecosystem by developing key building blocks for future packaging needs: packaging related processes, equipment and materials, advanced packaging and integration technologies, packaging design and simulation and testing, metrology and failure analysis.
Impact of the project:
The EuroPAT-MASIP promotes the capabilities and the related ecosystem, feeding also to attracting talent and academic education issues. Ultimately, the project results will increase the attractiveness for private investments and talent by developing and promoting the key capabilities to match the future needs of European industries and emerging technology drivers.
Funding instrument H2020 ECSEL JU
Spinverse’s role
In the funding proposal process, Spinverse was assigned to facilitate the funding proposal writing.
During the project, Spinverse will provide project management services and support the coordinator while also handling communication and dissemination.
Supporting the UN Sustainable Development Goals
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