This collaborative project builds the competitive edge of component and systems development in Europe. New capabilities are developed and their match is demonstrated to the future needs of European industries. This accelerates the manufacturing uptake of the new technologies and shortens time-to-market.
The project brings together a consortium of 31 European electronics packaging, optics and photonics key players and leading equipment suppliers and testing experts on launching a new project, “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe,” simply called APPLAUSE.
This Electronics Components and Systems for European Leadership Joint Undertaking (ECSEL JU) project fosters the European semiconductor value chain by building new tools, methods and processes for high volume manufacturing of electrical and optical components. The total budget of 34 M€ for the three-year project is co-funded by Horizon 2020 and national funding agencies and industries as a part of the ECSEL JU.
How we reached the goals
During the proposal preparation phase, Spinverse assisted in all the steps from the project formulation and putting together a strong consortium to ensuring the high quality of the submitted project proposal, and provides continued daily administration support in running the project.
The expected project impacts include a revenue increase for many project partners, the total revenue impact exceedinging 300 M€ by 2025. The new technologies developed in the project have the potential for increased market share with additional access to new market segments for the industrial partners.