Electronics packaging ecosystem
Customer story in numbers
Horizon 2020 Electronics Components and Systems for European Leadership
Increasing the competitiveness and global market share of the European semiconductor industry and accelerating the manufacturing uptake of the new technologies
The “European Packaging, Assembly and Test Pilot for Manufacturing of Advanced System-in-Package” project will consolidate and extend the European leadership in semiconductor processing know-how and contribute towards keeping Europe at the forefront of the electronics technology development by developing and fostering packaging related technological and manufacturing building blocks, serving different (emerging) industrial sectors.
How we reached the goals
The project’s main goals are: Increasing the competitiveness and global market share of the European semiconductor industry and accelerating the manufacturing uptake of the new technologies and shortening time-to-market.
In the application process, Spinverse was assigned to facilitate the proposal writing process. During the project Spinverse will administrate the project management and support the coordinator while handling also communication and dissemination.
The EuroPAT-MASIP consortium will actively promote the capabilities and the related ecosystem, feeding also to attracting talent and academic education issues. Ultimately, the project results will increase the attractiveness for private investments and talent by developing and promoting the key capabilities to match the future needs of European industries and emerging technology drivers.
Photo by Igor Ovsyannykov on Unsplash