Customer story
APECS to establish the European pilot line for advanced heterogenous packaging
"Spinverse had very good professional understanding of the project and knowledge of proposal formalities and procedures. Their combination of skills made them an invaluable partner for our APECS proposal, significantly contributing to our success. "
Dr. Stephan Guttowski, Head of FMD, Fraunhofer.
Customer story in numbers
730
M€
5
Years
10
Partners
Funding instrument
Chips Joint Undertaking (JU), HEU and Digital Europe
Advanced Packaging and Heterogeneous Integration of Electronic Components and Systems (APECS), will establish the European pilot line for advanced heterogeneous packaging.
Key challenges
The APECS pilot line, coordinated by Fraunhofer Group for Microelectronics / Research Fab Microelectronics Germany (FMD), aims to bolster the European Union's capabilities in the semiconductor sector, particularly in the development of next-generation technologies for advanced packaging and the integration of diverse chip and chiplet technologies.
How we reached the goals
Spinverse funding experts supported Fraunhofer in their funding proposals by developing and optimising the content to ensure it matched the strict evaluation criteria set for the applicants. Spinverse was also supporting FMD in grant agreement negotiations.
Key takeaways
The APECS pilot line is expected to have a transformative effect on the European semiconductor landscape by offering a European prototyping and piloting option for advanced packaging and heterogeneous integration.
Impact of the project
Access to European advanced packaging technologies and prototyping, fostering European semiconductor value chain, community and skills.