Innovation Challenge as a springboard to success17 Jul 2019
While Spinverse Innovation Challenge allows the large companies looking for new ideas to find truly out-of-t...
Spinverse has helped EuroPAT-MASIP project to secure funding from the Horizon 2020 programme within the “Electronics Components and Systems for European Leadership” (ECSEL) Joint Undertaking. The project ranked in the top 3 proposals submitted.
The EuroPAT-MASIP project, which has 28 partners from all over Europe, will reinforce the European semiconductor manufacturing position through focusing on the specific challenge of semiconductor and MEMS packaging. Semiconductor packaging, assembly and testing involve players throughout the whole value chain, ranging from material suppliers to software design and packaging foundries to test houses. EuroPAT-MASIP will consolidate and extend the European leadership in semiconductor processing know-how, by developing and fostering packaging related technological and manufacturing building blocks, serving various emerging industrial sectors.
Today, no industrial product, no entertainment, no defence system is conceivable without extensive usage of the electronic components. The demand and requirements from industry have always been one of the strongest technology drivers for advanced electronics packaging. A persistent target is to find new solutions for increased performance, improved form factors and reduced costs. Even though research and development activities in electronics are still in major part done in Europe, 90 % of the semiconductor manufacturing supply chain has moved to Asia during the past few decades. The burning question for Europe is: will R&D stay in Europe if manufacturing has moved to Asia completely?
Answering this question, Senior Consultant Eeva Viinikka commented: “The EuroPAT-MASIP project has the mission to contribute towards keeping Europe at the forefront of the electronics technology development. Furthermore, it aims to accelerate the manufacturing uptake of the new technologies and shorten time-to-market by demonstrating the new capabilities to match the future needs of European industries and emerging technology drivers”.
The ECSEL Joint Undertaking approved funding for 13 new projects totalling to 725 M€ R&D&I effort, receiving financial support from the EU and participating National authorities. The projects are to reinforce smart, sustainable, and inclusive economic growth for Europe, significantly contributing to European competitiveness and job creation.
About ECSEL JU
The “Electronic Components and Systems for European Leadership” (ECSEL) is a Joint Undertaking established in June 2014 by the European Union Council Regulation No 561/2014. It is a public-private partnership that will engage, from 2014 to 2020, up to 1.17 B€ funding from the European Union’s Horizon 2020 research and innovation programme, combining it with a commensurate amount of national/regional funding and participants’ own contributions to leverage about 5 B€ Research and Innovation investments in nanoelectronics, embedded and cyber-physical systems, and system integration technologies. The R&D actors are represented by the associations AENEAS, ARTEMISIA and EPoSS. Read more about the ECSEL JU programme.
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