- Blog article -

EuroPAT-MASIP project secures Horizon 2020 funding to bring back manufacturing to Europe

2 Feb 2017

Spinverse has helped EuroPAT-MASIP project to secure funding from the Horizon 2020 programme within the “Electronics Components and Systems for European Leadership” (ECSEL) Joint Undertaking. The project ranked in the top 3 proposals submitted.

The EuroPAT-MASIP project, which has 28 partners from all over Europe, will reinforce the European semiconductor manufacturing position through focusing on the specific challenge of semiconductor and MEMS packaging. Semiconductor packaging, assembly and testing involve players throughout the whole value chain, ranging from material suppliers to software design and packaging foundries to test houses. EuroPAT-MASIP will consolidate and extend the European leadership in semiconductor processing know-how, by developing and fostering packaging related technological and manufacturing building blocks, serving various emerging industrial sectors.

Today, no industrial product, no entertainment, no defence system is conceivable without extensive usage of the electronic components. The demand and requirements from industry have always been one of the strongest technology drivers for advanced electronics packaging. A persistent target is to find new solutions for increased performance, improved form factors and reduced costs. Even though research and development activities in electronics are still in major part done in Europe, 90 % of the semiconductor manufacturing supply chain has moved to Asia during the past few decades. The burning question for Europe is: will R&D stay in Europe if manufacturing has moved to Asia completely?

Answering this question, Senior Consultant Eeva Viinikka commented: “The EuroPAT-MASIP project has the mission to contribute towards keeping Europe at the forefront of the electronics technology development. Furthermore, it aims to accelerate the manufacturing uptake of the new technologies and shorten time-to-market by demonstrating the new capabilities to match the future needs of European industries and emerging technology drivers”.

The ECSEL Joint Undertaking approved funding for 13 new projects totalling to 725 M€ R&D&I effort, receiving financial support from the EU and participating National authorities. The projects are to reinforce smart, sustainable, and inclusive economic growth for Europe, significantly contributing to European competitiveness and job creation.

About ECSEL JU
The “Electronic Components and Systems for European Leadership” (ECSEL) is a Joint Undertaking established in June 2014 by the European Union Council Regulation No 561/2014. It is  a  public-private partnership  that  will  engage,  from 2014  to  2020,  up  to  1.17  B€  funding  from  the  European  Union’s Horizon 2020 research and innovation programme, combining it with a commensurate amount of  national/regional  funding  and  participants’  own  contributions  to  leverage  about  5 B€  Research  and  Innovation  investments  in  nanoelectronics,  embedded  and  cyber-physical  systems,  and  system   integration   technologies. The   R&D   actors   are   represented by the associations AENEAS, ARTEMISIA and EPoSS. Read more about the ECSEL JU programme.

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